GC-HA | Chip peeling test attachment / Hanging attachment | IMADA SEISAKUSHO
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GC-HA
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ATTACHMENTS (JIGS)
Chip peeling test attachment / Hanging attachment
| Type | Max. Load | Specification | Upper Weight |
|---|---|---|---|
| GT-52 | 500N | Wide10mm | 105g |
| GT-53 | 100g | ||
| GC-91 | 2kN | Open wide 0～4mm | 150g |
• GT-52 / GT-53 are used for the purpose of semiconductor peeling.
GT-52 : For pulling.
GT-53 : For pushing.
• GC-91 is the jig for hanging samples. Tensile test of wire crimp terminal is possible by using with GT-30-2W.
GT-52 : For pulling.
GT-53 : For pushing.
• GC-91 is the jig for hanging samples. Tensile test of wire crimp terminal is possible by using with GT-30-2W.
Dimension
| แบรนด์สินค้า | IMADA SEISAKUSHO |
|---|---|
| Order No. | GC-HA |
Dimension
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